The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2000
Filed:
Jan. 26, 1998
Applicant:
Inventors:
Il Kwon Shim, Seoul, KR;
Sun Ho Ha, Kyungki-Do, KR;
Assignees:
ANAM Semiconductor Inc., Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438111 ; 438123 ; 438126 ;
Abstract
Provided with a method of manufacturing a ball grid array semiconductor package using a flexible circuit board strip, which is directed to prevent minute conductive traces in the outer part of a circuit pattern formed in the flexible circuit board and thus minimize the short-circuits by forming notches on the flexible circuit board in the vicinity of the lower side ends of a resin encapsulant section by use of a punch, and pressing down the resin encapsulant section with a singulation tool to remove the carrier frame and separate the ball grid array semiconductor packages in the piece.