The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2000
Filed:
Mar. 18, 1998
Mark F Sylvester, Eau Claire, WI (US);
W. L. Gore & Associates, Inc., Newark, DE (US);
Abstract
A chip package is provided for controlling warp of electronic assemblies. The chip package has a first component mounted on one side of a substrate. The substrate is a multi-layered laminate having a plurality of dielectric layers made of an organic material. The first component has a different coefficient of thermal expansion (CTE) than the substrate. The chip package includes a second component mounted on an opposite side of the substrate in a location substantially opposite the first component. The second component has a CTE that approximately matches the CTE of the first component. The second component tends to generate bending moments that offset distorting bending moments that may otherwise exist in the chip package without the second component.