The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 1999

Filed:

Oct. 01, 1997
Applicant:
Inventors:

Shunsuke Kugo, Kyoto, JP;

Hideo Nikoh, Shiga, JP;

Tomoyuki Sasaki, Kyoto, JP;

Hideo Ichimura, Osaka, JP;

Daihei Kajiwara, Toyama, JP;

Shoji Matsumoto, Toyama, JP;

Satoshi Nakagawa, Toyama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; H01L / ;
U.S. Cl.
CPC ...
156345 ; 216 67 ; 438710 ;
Abstract

A semiconductor substrate which is placed on a bottom electrode inside a chamber is dry-etched by creating plasma inside the chamber. By making the average surface roughness Ra of the bottom surface of a quartz-top plate placed on the bottom electrode be in a range of 0.2 to 5 .mu.m, adhesion between the quartz-top plate and the deposits caused by the dry etching is enhanced, and the number of particles suspended in the chamber is reduced. Furthermore, the function of enhancing the adhesion of deposits can be maintained even after cleaning of the quartz-top plate. As a result, the number of particles which adhere onto the semiconductor substrate is reduced and the semiconductor substrate can be processed in an extremely clean atmosphere.


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