The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 1999
Filed:
Nov. 25, 1997
Applicant:
Inventor:
Kazuhiko Bandoh, Kyoto, JP;
Assignee:
Towa Corporation, Kyoto, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ; B29C / ; B29C / ;
U.S. Cl.
CPC ...
425116 ; 4251261 ; 425226 ; 425233 ; 4251 / ; 425193 ; 425574 ; 425588 ; 425444 ; 425D / ;
Abstract
A method of and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded resin materials electronic parts that are mounted on lead frames. Additional molding units are detachably mounted with respect to an already provided first molding unit in the molding apparatus, so that the number of the molding units can be arbitrarily adjusted. In this manner, the method and apparatus can be easily reconfigured or rearranged to be adapted to mass production or small production runs of the same or different types of molded parts. By simultaneously carrying out various process steps, the overall process time is reduced.