The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 1999
Filed:
Nov. 24, 1997
Darryl M Stansbury, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A method of forming ball bumps on a pad of a semiconductor die using aluminum wire is provided. The method includes providing an aluminum wire and a thermosonic ball bonding apparatus. The aluminum wire is held in a capillary tool of the ball bonding apparatus and a molten ball is formed on the wire using an electronic flame off (EFO). A forming gas comprising hydrogen and an inert gas, prevents the molten ball from oxidation hardening during formation thereof. Following formation, the molten ball is shaped into a ball bump by the capillary tool and then pressed against the pad while the capillary tool is vibrated. The completed die can be bonded to a substrate pad on a supporting substrate by using a bonding technique such as flip chip bonding, chip on glass bonding, chip on flex bonding, TAB bonding, and z-axis adhesive bonding.