The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 14, 1999

Filed:

Jun. 23, 1997
Applicant:
Inventors:

David M Arken, San Jose, CA (US);

Andrew Chiu, San Jose, CA (US);

Joseph John Fatula, Jr, San Jose, CA (US);

Robert William Hitzfield, San Jose, CA (US);

Wen-Chien David Hsiao, San Jose, CA (US);

Yiping Hsiao, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ; C25D / ; C25B / ;
U.S. Cl.
CPC ...
205137 ; 205 98 ; 205 80 ; 204212 ; 204237 ; 2042 / ; 204273 ; 204D / ;
Abstract

A rotary plater and method of plating are provided which improve the uniformity of plating across a plating surface of a workpiece. A plating solution distribution device is located in a plating cup between an anode and a cathode in a spaced relationship therebetween and is centered about a vertical axis of the plating cup. A motor is provided for relatively rotating the cathode and the plating solution distribution device with respect to one another. The plating solution distribution device distributes the plating solution over the plating surface at a distribution rate which increases radially outwardly from the vertical axis. With this arrangement the volume of plating solution at the outer periphery of the plating surface is enriched with ions to promote plating uniformity.


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