The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 1999
Filed:
Apr. 16, 1997
Applicant:
Inventors:
Mukul Saran, Richardson, TX (US);
James F Garvin, Jr, Carrollton, TX (US);
Wei-Yung Hsu, Dallas, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438685 ; 438629 ; 438625 ; 438648 ; 438688 ; 438637 ;
Abstract
A method of filling openings (20, 50) in a semiconductor (10, 40) includes the steps of first forming a fill metal layer (30, 60) over the semiconductor which substantially covers the openings (20, 50). Thereafter, a surface coating (32, 62, 64) of a predetermined material is formed over the fill metal layer (30, 60). Then, high pressure is applied on the surface coating (32, 62, 64) to force the fill metal into the openings (20, 50). Metal film surface cracks previously plaguing force-fill processes are thereby eliminated or substantially reduced.