The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 1999

Filed:

Aug. 06, 1998
Applicant:
Inventor:

Toshihiro Nakamori, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361704 ; 361707 ; 361708 ; 361709 ; 361749 ; 361750 ; 361751 ; 361785 ; 174252 ; 174254 ; 165185 ;
Abstract

An effective heat-sinking arrangement is realized for circuit elements used in a portable type information terminal having a small restricted space therein. Wherein, a first substrate has a cavity formed in its insulating layer extending to an earthing layer and filled with a silver paste to form a seat for mounting a CPU that can thus thermally contact with the earthing layer, and a second substrate has a cavity formed in an insulating layer in which cavity a heat-conducting cushion bonded to the top of the CPU is fitted for creating the heat-conductive route between the CPU and the earthing layer of the second substrate.


Find Patent Forward Citations

Nakamori, Toshihiro. (1999). Heat-sinking arrangement for circuit elements (U.S. Patent No. 5995370). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5995370

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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