The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 30, 1999

Filed:

Apr. 02, 1998
Applicant:
Inventors:

Chi-Fung Lo, Fort Lee, NJ (US);

Darryl Draper, Congers, NY (US);

Assignees:

Sony Corporation, Tokyo, JP;

Materials Research Corporation, Orangeburg, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C / ; C23C / ; C22F / ;
U.S. Cl.
CPC ...
148577 ;
Abstract

A method is provided for fabricating aluminum alloy sputtering targets having fine precipitates of a second phase material in small, randomly oriented and uniform grains. The method provided includes the steps of homogenizing the aluminum alloy billet at a temperature above the solidus temperature, deforming the billet, recrystallizing the billet at a temperature below the solidus temperature, and cryogenically deforming the billet. This minimizes second-phase precipitate size and prevents the formation of cubic structures, thereby generating fine uniform grain sizes having random orientation.


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