The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 1999
Filed:
Jun. 17, 1998
Applicant:
Inventors:
Joseph V Cesna, Niles, IL (US);
Inki Kim, Tempe, AZ (US);
Assignee:
Speedram Corporation, Chanlder, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451 41 ; 451 44 ; 451 59 ; 451 63 ;
Abstract
In semiconductor wafer polishing, a backing pad is sized smaller than the wafer being polished so as to produce a desired backset, allowing the wafer to bend, thereby reducing over-polish at the wafer edge.