The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 16, 1999
Filed:
Jun. 26, 1997
John W Vanderpot, Boxford, MA (US);
John D Pollock, Rowley, MA (US);
Novellus Systems, Inc., San Jose, CA (US);
Abstract
The invention provides wafer handling apparatus for use with a wafer handling mechanism of the type that supports and transports wafers through and during semiconductor processes. Typically, the wafer has a first surface for semiconductor processing and a second surface having a surface finish with microfeatures therein. The invention utilizes at least three prongs extending from the mechanism and arranged to support the wafer. A stylus tip--preferably made from diamond--resides at a distal end of each prong. Each tip has a point that is smaller than at least some of the microfeatures of the second surface of the wafer such that the interaction of the tips with the microfeatures resists lateral movement of the wafer relative to the tips when the wafer rests on the tips by the force of gravity. This interaction is sufficient to move the wafer without substantial contribution from the coefficient of friction between the tips and the wafer. The invention solves the problems of the prior art associated with outgassing by rubber pads and low coefficients of friction associated with quartz pads. Motors with feedback control adjust the speed at which the prongs interact with the wafers so as to prolong tip life.