The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 1999
Filed:
Jun. 25, 1997
Young Wook Heo, Seoul, KR;
Anam Semiconductor Inc., , KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A printed circuit board for a BGA semiconductor package provided at one corner thereof with a degating opening serving as a mold runner gate during a process of molding a resin seal adapted to protect the semiconductor chip and serving as a region for degating a surplus resin formed after the molding process and a method for molding a BGA semiconductor using the printed circuit board. The degating opening has an inverted triangular shape having curved lateral sides and a vertex, at which the lateral sides join together, disposed in a region for forming the resin seal, or an inverted trapezoidal shape having one end disposed in the resin seal region. The invention can eliminate the peeling or damage of the upper surface of the printed circuit board occurring upon degating a surplus resin, the damage of the printed circuit board due to a torsion thereof, the damage of conductive traces on the printed circuit board, the exposure of the conductive traces caused by the damage of a solder mask, and the damage of a resin seal on the printed circuit board. Therefore, an improvement in productivity and reliability is achieved.