The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 1999
Filed:
Apr. 06, 1998
Applicant:
Inventors:
Kuo-Yao Weng, Hsin-Chu, TW;
Yu-Chi Lin, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B44C / ; H01L / ;
U.S. Cl.
CPC ...
216 44 ; 216 43 ; 216 45 ; 438401 ; 438700 ;
Abstract
The present invention discloses a method for marking an electronic substrate without the splatter or debris defect which can be carried out by first providing a tape, then creating a cavity or a mark through the tape by a high-intensity energy beam or any other suitable mechanical means such that the tape can be laminated to a top surface of the substrate and exposed to an etchant until a similar mark in the substrate is reproduced by the etching process. After the tape is removed, the mark is reproduced in the surface of the electronic substrate.