The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 12, 1999
Filed:
Oct. 11, 1996
Applicant:
Inventor:
Klaus Dietrich Beyer, Poughkeepsie, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
438692 ; 438693 ; 438694 ; 438959 ;
Abstract
A planarizing method involves a first polishing step in which a relatively hard, low compressibility pad removes excess material of a first layer and planarizes the first layer. Deep defects emanating from the polishing surface formed during the first polishing step are then enlarged and filled with a second layer. After filling, and optionally annealing, the second layer is planarized by polishing with a relatively soft and high compressibility pad or by anisotropic etching.
Beyer, Klaus. (1999). Method for removing crevices induced by chemical-mechanical polishing (U.S. Patent No. 5965459). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5965459
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile