The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 1999
Filed:
May. 21, 1997
Applicant:
Inventors:
Krishna Gandhi Sachdev, Hopewell Junction, NY (US);
Michael Berger, Gardiner, NY (US);
Anson Jay Call, Poughkeepsie, NY (US);
Frank Louis Pompeo, Jr, Walden, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ; C08L / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
525118 ; 523458 ; 524440 ; 525486 ; 525504 ;
Abstract
An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin alone and/or a diepoxide resin admixed with a hydroxymethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) which can further contain an electrically or thermally conductive filler.
Sachdev, Krishna. (1999). Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or (U.S. Patent No. 5955543). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5955543
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile