The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 1999
Filed:
Nov. 19, 1997
Applicant:
Inventors:
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
428345 ; 428344 ; 428335 ; 174258 ; 174259 ; 1563071 ; 1563077 ; 430 83 ;
Abstract
A conductive circuit board is prepared by forming a film of organopolysilane having a H-Si bond on a substrate, selectively exposing the organopolysilane film to light to form a photo-crosslinked layer in exposed areas, dissolving away unexposed areas, and contacting a silver salt with the photo-crosslinked layer and reducing the silver salt to form a silver conductive layer thereon. A conductive circuit board comprising a circuit-patterned film of photo-crosslinked polymer on a substrate and a silver conductive layer on the film has high and stable electric property.