The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1999
Filed:
Aug. 20, 1997
Anam Semiconductor Inc., Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A ball grid array semiconductor package using a flexible circuit board, in which the flexible circuit board has no conductive via hole nor solder mask while having a thin structure formed at only one surface thereof with a circuit pattern having a small length. The flexible circuit board is mounted with a metallic carrier frame to achieve an easy handling thereof, a reduction in the inductance, impedance and coupling effect of adjacent circuit patterns and an easy discharge of heat from a semiconductor chip, thereby achieving an improvement in electrical performance and an improvement in heat discharge performance. The metallic carrier frame has a plurality of openings adapted to increase the bonding force between an encapsulate and constituting elements of the package, thereby removing a bending phenomenon of the package, and a method for fabricating such a BGA semiconductor package. The invention also provides a method for fabricating such a BGA semiconductor package.