The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 1999

Filed:

Oct. 17, 1997
Applicant:
Inventor:

Tim Bossart, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; B05C / ; H01L / ;
U.S. Cl.
CPC ...
427240 ; 118 52 ; 118500 ; 4273855 ; 427377 ; 437231 ;
Abstract

Disclosed is a spin coating apparatus and method for coating a semiconductor wafer of known diameter with a thin and substantially uniform coating of a solution. The apparatus comprises a containment bowl with a rotatable vacuum chuck, having a diameter less than hat of the wafer, rotatably mounted inside the bowl. The vacuum chuck captively holds a bottom surface of the wafer. Directly beneath the bottom surface of the wafer is a substantially frustroconical deflector ring. The deflector ring is concentrically attached about and stationary with respect to the rotatable vacuum chuck. The top surface of the ring is located just below and in close-spaced parallel relation to the bottom surface of the wafer. The top face of the deflector has a minimum diameter that is greater that the diameter of the semiconductor wafer. With the system of this invention the requirement of an organic solvent wash of the wafer backside after the coating of the wafer top surface is eliminated.


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