The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1999
Filed:
Apr. 07, 1998
Shinichi Ohori, Niigata-ken, JP;
Shin-Etsu Polyer Co., Ltd., Tokyo, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Abstract
A device for preventing wafer materials, such as semiconductor silicon wafers, held on a wafer cassette by inserting the wafers into respective wafer alignment grooves from contacting with adjacent wafers due to the larger width of the grooves than the thickness of the wafers to allow tilting thereof. The device is a rectangular frame mountable on the wafer cassette and provided on each of two oppositely facing sides with a wafer holding member in the form of a comb having comb teeth with the same regular pitch as that of the alignment grooves, the slit between adjacent comb teeth, into which the periphery of the wafer is inserted, having a width somewhat larger than the thickness of the wafer but smaller than the width of the wafer alignment groove to decrease the shaky condition of the wafer material.