The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 1999
Filed:
Feb. 06, 1997
Applicant:
Inventors:
Pedro A Chalco, Yorktown Heights, NY (US);
Raymond Robert Horton, Dover Plains, NY (US);
Chandrasekhar Narayan, Hopewell Junction, NY (US);
Michael Jon Palmer, Auburn, AL (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
21912163 ; 21912164 ;
Abstract
Thin film diffusion bonding of lead assemblies under severly limited spacing, thermal and pressure conditions is achieved through application of precisely controlled energy at the bond interface. The precisely controlled energy is a laser thermosonic energy pulse, delivered through a cleaved optical fiber end and closed end tip, that produces a heat increment in excess of the steady state manufacturing design temperature for the assembly and which is applied directly at the bond interface.