The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 1999
Filed:
Sep. 19, 1997
Applicant:
Inventor:
Thomas G McKay, Felton, CA (US);
Assignee:
Samsung Electronics Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257687 ; 257698 ; 257728 ; 257774 ; 257787 ;
Abstract
An MMIC includes I/O pads on the back side coupled to active circuit structures on the front side by standard through-the-substrate vias. The front side is covered by a passivation layer and the back side I/O pads facilitate testing utilizing standard wafer probing equipment. The back side I/O pads are formed utilizing standard MMIC process technology.
McKay, Thomas. (1999). Wire-bond free input/output interface for gaas ics with means of (U.S. Patent No. 5945734). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5945734
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile