The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 1999
Filed:
Apr. 09, 1996
Applicant:
Inventors:
Francois Gregoire, Cupertino, CA (US);
Raminda Madurawe, Sunnyvale, CA (US);
Guru Thalapaneni, Fremont, CA (US);
Assignee:
Altera Corporation, San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257773 ; 257784 ; 257786 ; 438612 ; 438622 ;
Abstract
Pad structures for an integrated circuit are provided that use via holes or slots rather than large pad openings to form electrical connections between successive metal interconnection layers. The via holes or slots are filled using standard metal etchback deposition techniques. The pad structures minimize particle generation during circuit fabrication. A number of the via holes or slots in the pad structure can be interconnected in parallel to provide a sufficient current handling capacity to distribute power to the active components on the integrated circuit.