The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 03, 1999

Filed:

May. 29, 1997
Applicant:
Inventors:

Seiji Katsuoka, Atsugi, JP;

Toyomi Nishi, Yokohama, JP;

Tetsuji Togawa, Chigasaki, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451285 ; 451286 ; 451287 ; 451288 ; 451289 ; 454187 ;
Abstract

A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus has an exhaust device for exhausting air in the polishing apparatus. The polishing apparatus includes a housing, a polishing section housed in the housing for polishing a workpiece, a cleaning section housed in the housing for cleaning the workpiece which has been polished, and a base comprising a plurality of structural members for supporting at least one device in at least one of the cleaning section and the polishing section. At least one of the structural members has a fluid passage therein and intake openings to serve as an exhaust duct. The polishing apparatus further comprises a main exhaust duct communicating with the exhaust duct and extending to an exterior of the housing for exhausting air introduced in the exhaust duct.


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