The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 1999

Filed:

Jun. 16, 1997
Applicant:
Inventors:

Madjid Hafizi, Santa Monica, CA (US);

Julia J Brown, Santa Monica, CA (US);

William E Stanchina, Thousand Oaks, CA (US);

Assignee:

Hughes Electronics Corporation, El Segundo, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438170 ; 438172 ; 438314 ; 148D / ; 257195 ; 257622 ; 257623 ;
Abstract

An integrated circuit technology combines heterojunction bipolar transistors (HBTs), high electron mobility transistors (HEMTs) and other components along with interconnect metallization on a single substrate. In a preferred embodiment a flat substrate is patterned, using dry etching, to provide one or more mesas in locations which will eventually support HEMTs. A device stack including HEMT and HBT layers is built up over the substrate by molecular beam epitaxy, with the active HEMT devices located on the mesas within openings in the HBT layer. In this way the active HEMT is aligned with the HBT layer to planarize the finished integrated circuit.


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