The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 1999
Filed:
Apr. 25, 1997
Shyn-Ren Chen, Taipei, TW;
Chii-Ming Morris Wu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Abstract
A structure of a bond pad to prevent probe pin contamination is disclosed herein a first conductor layer is formed on the substrate. A passivation layer including a titanium nitride layer, a silicon nitride layer, and a silicon oxide layer is formed on the first conductor layer. A photoresist layer is patterned on the passivation layer to define a contact hole, and then etching the passivation layer using the photoresist layer as a mask to form the contact hole. A second conductor layer serving as a top metal of bond pad harder than the first conductor layer is selectively deposited on the first conductor layer, and filled in the contact hole. The present invention can reduce a probe pin contamination so that extend the probe pin lifetime using this selective deposition technique to form the pond pad structure. Additionally, the structure can prevent the contact resistance between the probe pin head and the bond pad increasing, and reduce the probe pin overkill ratio.