The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 1999

Filed:

Jul. 24, 1997
Applicant:
Inventors:

Mahesh K Shah, Scottsdale, AZ (US);

John W Hart, Jr, Mesa, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438107 ; 438124 ; 438126 ; 438127 ;
Abstract

A semiconductor component includes a leadframe (10), an electronic component (21) mounted over the leadframe (10), a packaging material (23) around the electronic component (21) and the leadframe (10) wherein the packaging material has a recess (24), another electronic component (30) in the recess (24), and a cap (32) over the recess (24) and the other electronic component (30). The other electronic component (30) is electrically coupled to the electronic component (21) through internal leads (13) and (14) of the leadframe (10). After a dam bar (15) is removed from the leadframe (10), the internal leads (13) are physically and electrically isolated from other portions of the leadframe (10) including the external leads (12) and the flag (11).


Find Patent Forward Citations

Shah, Mahesh. (1999). Semiconductor component and method of fabrication (U.S. Patent No. 5918112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5918112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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