The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 1999
Filed:
May. 15, 1997
Applicant:
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438666 ; 438714 ; 438720 ; 438643 ;
Abstract
An improved and new method of forming tungsten plugs on contact holes in semiconductor integrated circuit devices has been developed. The method uses a two step tungsten etchback process wherein redeposition of etch byproducts is surpressed, residue removal is enhanced, and the overetching requirement is reduced. The result is a more reliable, lower cost, higher yield process.
Lo, Chi-Hsin. (1999). Blanket etching process for formation of tungsten plugs (U.S. Patent No. 5915202). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5915202
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile