The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 1999
Filed:
Nov. 04, 1996
Applicant:
Inventors:
Takuji Itoh, Osaka, JP;
Toshihiko Kubo, Osaka, JP;
Assignee:
Sumitomo Metal (SMI) Electronics Devices, Inc., Yamaguchi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257737 ; 257738 ; 257778 ; 257779 ;
Abstract
A semiconductor package and a semiconductor device comprises a metal bump to be placed between a metal pad formed on a package body of a substantially plate-like shape and an interconnecting solder for connecting a metal ball thereto, wherein the melting point of the metal bump is higher than that of the interconnecting solder, thereby enhancing a fatigue resistance against temperature fluctuations as well as improving a reliability around the interconnecting portion.