The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1999
Filed:
Nov. 20, 1996
Applicant:
Inventors:
Assignee:
Hyundai Electronics Industries Co., Ltd., Kyoungkido, KR;
Primary Examiner:
Int. Cl.
CPC ...
G03F / ;
U.S. Cl.
CPC ...
430329 ; 430313 ; 430330 ;
Abstract
A method of removing a polymer of a semiconductor device is disclosed including the steps of: forming a photoresist pattern on a to-be-etched layer; etching the to-be-etched layer using a mixed gas containing carbon/fluorine compound and oxygen gas with the use of the photoresist pattern; and removing the photoresist pattern at a temperature of below 200 C., and at the same time, dry-etching a polymer, the polymer being generated during the etching of the to-be-etched layer, the photoresist pattern being removed in a dry etching chamber.
Quick Actions:
Kim, Sang. (1999). Method of removing polymer of semiconductor device (U.S. Patent No. 5908735). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5908735
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