The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1999
Filed:
Apr. 11, 1997
Makoto Nakajima, Nagano, JP;
Yoshio Nakamura, Nagano, JP;
Yasuhide Denda, Nagano, JP;
Toshihisa Yanagisawa, Nagano, JP;
Toshiaki Seki, Nagano, JP;
Satoru Arakawa, Nagano, JP;
Masahiro Takeuchi, Nagano, JP;
Mitsue Ogawa, Nagano, JP;
Masanori Fukushima, Nagano, JP;
Fujikoshi Kikai Kogyo Kabushiki Kaisha, Nagano-ken, JP;
Abstract
In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.