Multi-chip module development substrate

Abstract

A multi-chip module development substrate (12) contains embedded test circuitry (30). Vias (38) connect I/O channels (Cn) of the test circuitry with conductive runs in interconnect layers (16,18) that are part of an interconnect structure (17) of the development substrate. Integrated circuit chips (14) are then mounted on the multi-chip module development substrate in selected electrical contact with the conductive runs. The embedded test circuitry includes multiple timing analyzer circuits (TAn) and multiple analog probe circuits en). In a preferred embodiment, these timing analyzer circuits and analog probe circuits are provided in redundant pairs, with a pair of each associated with each of the I/O channels. Multiple pairs of each kind of circuit are grouped within test cells (70) physically arranged in rectangular areas. Adjacent test circuit cells may be rotated with respect to each other to achieve more efficient connections to interconnect structure. After verification testing for proper operation of the multi-chip module circuitry, production versions of the multi-chip module are fabricated on multi-chip module production substrates not containing the test circuitry, thereby removing the extra cost and complexity associated with the development substrate.