The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 1999
Filed:
Dec. 04, 1997
Applicant:
Inventors:
Akihiro Yamamoto, Kobe, JP;
Makoto Imanishi, Neyagawa, JP;
Takahiro Yonezawa, Neyagawa, JP;
Shinzo Eguchi, Kyotanabe, JP;
Osamu Nakao, Osaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B30B / ; H01L / ;
U.S. Cl.
CPC ...
100 35 ; 100 48 ; 100 99 ; 1002 / ; 100231 ; 257737 ; 257778 ;
Abstract
A bump leveling method and a bump leveling apparatus in which the leveled height of bumps can be made constant and meet the change in thickness of an IC chip. A pressing force under which one bump is deformed to a prescribed height is measured. Thus, the pressing force under which a plurality of bumps can be deformed and leveled can be set. A load cell detects that a prescribed pressing force is exerted on the bumps and this pressing force is maintained, so that the plurality of bumps can be leveled up to the same prescribed height.