The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 1999
Filed:
Jul. 02, 1998
David G Love, Pleasanton, CA (US);
Larry L Moresco, San Carlos, CA (US);
Fujitsu Limited, , JP;
Abstract
A method of interconnecting integrated circuit chips to a substrate during the assembly of a multi-chip module. Instead of forming an electrical and physical bond by reflowing solder bumps attached to the pads of the chips and the substrate, as in flip-chip bonding, thin pads of specially selected dissimilar metals placed on the chips and substrate are connected by a solid-state diffusion bonding process. In one embodiment, the I/O pads on a chip are formed from aluminum or an aluminum alloy and are aligned and placed into physical contact with corresponding metal pads or metal layered pads on a substrate, where the metal is capable of being diffusion bonded to aluminum. The combination of chip(s) and substrate are then heated in a controlled atmosphere at a temperature and for a time sufficient to cause solid-state diffusion bonding to occur.