The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 1999
Filed:
Jul. 21, 1997
Applicant:
Inventors:
Akira Takata, Kobe, JP;
Tetsuo Hikawa, Kobe, JP;
Takashi Sawada, Kobe, JP;
Tom Dang-hsing Yiu, Milpitas, CA (US);
Ful-Long Ni, San Jose, CA (US);
Assignees:
Mega Chips Corporation, Osaka, JP;
Other;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
174 524 ; 257691 ; 257693 ;
Abstract
In order to reduce the chip size of a semiconductor device as well as to separate noises between at least two types of pads having different functions, power supply pins and ground pins are provided on opposite edges of a package with input address pins being arranged therebetween and output data pins being arranged outside the same. Control pins and a nonconnected excess pin are arranged in the center. This allows the package to omit wires and reduce chip size.