The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 1999

Filed:

Apr. 21, 1997
Applicant:
Inventor:

Gregory Turturro, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361705 ; 257713 ; 361719 ; 361789 ;
Abstract

An integrated circuit package that contains an integrated circuit that is mounted to a bond portion of a substrate. The bond portion of the substrate is separated from a contact portion of the substrate by a flexible portion. The contact portion is attached to a printed circuit board by a plurality of solder joints. The flexible portion decouples the bond portion from the contact portion to allow relative movement between the package and the circuit board to minimize the strain on the solder joints. The package may also contain a spacer that separates a heat pipe from the integrated circuit and controls the thickness of a thermal grease located between the circuit and the pipe.


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