The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1999
Filed:
Nov. 03, 1997
James P Letterman, Jr, Mesa, AZ (US);
Reginald K Asher, Scottsdale, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An electrical insulation for a heatsink (14) of a semiconductor device (10) is provided by an insulating layer (16) formed on a desired portion or portions of the semiconductor device (10) to protect a semiconductor die (17) from arcing currents due to high voltage potentials. The insulating layer (16) is formed from a non-conductive powder coating which is applied to the semiconductor devices (10) by attracting the powder to the semiconductor device (10) in one of four ways. Either a fluidized powder bed process, an electrostatic fluidized bed process, an electrostatic spraying process, or the powder is applied during the mold process on the desired surface of the semiconductor device (10). Once the powder coating is applied to the heatsink (14), the semiconductor package is cured to form the insulating layer (16). The insulating layer (16) can also be formed over other portions the semiconductor device (10) such as a body (13), leads (12), or a leadframe (11).