The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 1999
Filed:
Sep. 12, 1996
Applicant:
Inventors:
Hiroshi Matsubara, Nara, JP;
Yasuhiro Sakamoto, Tenri, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257674 ; 257668 ; 257779 ;
Abstract
A highly reliable assembly structure is provided by surely reducing a stress to be exerted on leads of a TCP device. Part of a soldered portion of outer leads that is located closer to a semiconductor chip of the TCP device is reinforced by a support ring formed on a side of the outer leads opposite from a circuit board, so that a stress to be exerted on the outer leads is dispersed to the leads, the support ring and solder to thereby prevent the possible occurrence of metal fatigue of the leads.
Matsubara, Hiroshi. (1999). Device assembly structure with reinforced outer leads (U.S. Patent No. 5877543). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5877543
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile