The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 1999
Filed:
Oct. 08, 1997
Applicant:
Inventors:
Hariklia Deligianni, Edgewater, NJ (US);
William Hsioh-Lien Ma, Fishkill, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03C / ;
U.S. Cl.
CPC ...
430312 ; 430323 ; 430313 ; 430329 ;
Abstract
Ball limited metallurgy is used in conjunction with defining a solder deposit volume using an aperture in a resist layer and reflow of electroplated solder materials deposited in that aperture, possibly with planarization after deposition to enhance volume accuracy, to develop solder deposits extending up to 10 .mu.m or more above the surface on which solder is deposited. Such deposits can be made at fine pitch and provide solder connections of high reliability even when the distance which must be bridged by the solder connection is not easily or reliably regulated.