The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 1999

Filed:

Aug. 07, 1997
Applicant:
Inventors:

Harish D Merchant, Hinckley, OH (US);

Sidney J Clouser, Chardon, OH (US);

Assignee:

Gould Electronics Inc., Eastlake, OH (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22D / ; B41M / ;
U.S. Cl.
CPC ...
428544 ; 428209 ; 428606 ; 428615 ; 428344 ; 205 50 ; 205 77 ; 205148 ; 205170 ;
Abstract

This invention relates to an improved high performance flexible laminate, comprising: a layer of electrodeposited copper foil overlying a layer of a flexible polymeric material, said copper foil being characterized by an ultimate tensile strength at 23.degree. C. of at least about 60,000 psi, a loss of ultimate tensile strength at 23.degree. C. of no more than about 15% after being annealed at 180.degree. C. for 30 minutes, an average grain size of up to about 1 micron, and a fatigue performance characterized by at least about 5000 cycles to failure when the strain amplitude is about 0.05% to about 0.2%. In one embodiment, the copper foil is electrodeposited using an electrolyte solution characterized by a free chloride ion concentration of up to about 4 ppm and an organic additive concentration of at least about 0.3 ppm.


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