The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 1999
Filed:
Dec. 11, 1996
Young Wook Heo, Kyungki-Do, KR;
Byung Joon Han, Seoul, KR;
ANAM Semiconductor Inc., Seoul, KR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A process for manufacturing chip size semiconductor package with a light, thin, and compact structure having a reduced size of its semiconductor chip while having an increased number of pins For the package, it is possible to use either the semiconductor chip having bond pads arranged on end portions of the chip or the semiconductor chip having bond pads arranged on the central portion of the chip. In either case, input/output terminals of the package are arranged in the form of an area array. Accordingly, when the package is mounted on an electronic appliance, its mounting area can be minimized, thereby achieving a compactness of the final product.