The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 1998

Filed:

Apr. 25, 1997
Applicant:
Inventors:

Sang-Hwan Lee, Daejeon, KR;

Jong-Tae Moon, Seoul, KR;

Min-Kyu Song, Daejon, KR;

Nam Hwang, Daejeon, KR;

Seong-Su Park, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B / ;
U.S. Cl.
CPC ...
385 49 ; 385 88 ; 385 93 ;
Abstract

An improved optical module having lenses aligned on a lens-positioning V-groove and a fabrication method thereof which includes a silicon substrate, which defines a light transfer path below a surface thereof, including light transferring V-grooves and a light receiving V-groove, and lens-positioning V-groove for determining the position of a lens, wherein two lens-positioning V-grooves are formed therein, an optical transmitter module including a laser which is a light source and is flip-chip-bonded to the substrate by a solder bump after an optical waveguide is previously aligned with the V-groove by using an alignment mark behind the vertical portion of the light transferring v-groove. A light transferring lens attached on one lens-positioning V-groove for condensing the light from the laser, and a laser monitoring optical detector arranged on a side wall opposite the laser of the light transferring V-groove, wherein an active region is flip-chip-bonded toward the substrate, for monitoring the laser, and an optical receiver module including a light receiving lens attached on the lens-positioning V-groove of the silicon substrate for condensing beam externally transferred thereto, and a light receiving optical detector attached to the light receiving lens for detecting beam externally transferred thereto, wherein the optical transmitter module and the optical receiver module are arranged in the same silicon substrate.


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