The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 1998
Filed:
Sep. 06, 1996
Scott Lane, Chandler, AZ (US);
Dinesh Shah, Fremont, CA (US);
Ronald Colman, Maryport, GB;
Liam R Heading, Livingston, GB;
Eric Simpson, Edinburgh, GB;
ATMI Ecosys Corporation, San Jose, CA (US);
Abstract
A flow stabilization system for damping pressure variations in a process discharging an effluent gas stream, in which the process is pressure-sensitive and downstream pressure variations can adversely affect the upstream process, said system comprising a motive fluid driver constructed and arranged to receive the effluent gas stream from the process, and means for sensing a flow characteristic of the effluent gas stream and responsively adjusting the flow of the effluent gas stream to damp pressure fluctuations in the process. The flow stabilization system may further comprise: (i) a variable frequency drive for motively operating the motive fluid driver at a correspondingly variable rotational speed; (ii) a pressure transducer monitor for monitoring the flow characteristic of the effluent gas stream and generating a pressure transduced signal; and (iii) a proportional integral derivative controller coupled in pressure transduced signal-receiving relationship with the pressure transducer monitor, and responsive to the pressure transduced signal to correspondingly adjust the variable frequency drive and responsively selectively drive the motive fluid driver to damp pressure fluctuations in the process. The system has applicability to stabilizing pressure-sensitive processes such as vapor phase coating and reaction processes in semiconductor manufacturing.