The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 1998
Filed:
Jul. 24, 1996
Applicant:
Inventors:
James V Tietz, Fremont, CA (US);
Benjamin Bierman, Milpitas, CA (US);
David S Ballance, Cupertino, CA (US);
Assignee:
Applied Materials Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F27D / ;
U.S. Cl.
CPC ...
432258 ; 432241 ; 432253 ; 432259 ; 392418 ;
Abstract
An annular-shaped edge ring support for a semiconductor wafer has an innermost radial portion for supporting the semiconductor wafer and an outermost radial portion contiguous with the inner portion. The inner portion has a graded thermal mass that generally increases with increasing radius.
Tietz, James. (1998). Semiconductor wafer support with graded thermal mass (U.S. Patent No. 5848889). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5848889
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile