The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 1998

Filed:

Feb. 24, 1997
Applicant:
Inventors:

Li-Chun Li, Los Gatos, CA (US);

Lawrence C Liu, Menlo Park, CA (US);

Michael A Murray, Bellevue, WA (US);

Assignee:

Mosel Vitalic Corporation, San Jose, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257786 ; 257776 ; 257691 ; 257779 ; 257668 ;
Abstract

An integrated circuit has a supply node for supplying power to at least one intermediate node coupled to circuitry for receiving power. Rather than transmit power from the supply node to the intermediate node by means of a power bus formed as part of the chip interconnect structure, power is supplied to an external wire which is coupled from the supply to the intermediate node. Other than as connected to the supply node and intermediate node, the wire is electrically isolated from the die. This structure and method for making the semiconductor package allow power to be distributed within a semiconductor chip without sacrificing valuable chip space and without requiring a special lead frame for distributing the power within the semiconductor chip.


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