The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1998
Filed:
Apr. 21, 1995
Thomas J Hunt, Peekskill, NY (US);
Paul S Gilman, Suffern, NY (US);
Sony Corporation, Tokyo, JP;
Materials Research Corporation, Orangeburg, NY (US);
Abstract
This invention is directed to an improved method for making a bonded sputter target/backing plate assembly as well as assemblies produced therefrom. The assembly includes a sputter target having a bonding surface which is bonded to the bonding surface of an underlying backing plate. The method of forming the bonded assembly includes treating one of the bonding surfaces, either by roughening at least a portion of one of the bonding surfaces so as to produce a roughened portion having a surface roughness (R.sub.a) of at least about 120 micro inches, or by drilling a plurality of holes in one of the bonding surfaces. The method further includes orienting the sputter target and backing plate to form an assembly having an interface defined by the bonding surfaces, subjecting the assembly to a controlled atmosphere, heating the assembly, and pressing the assembly so as to bond the bonding surfaces.