The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 1998

Filed:

Jun. 24, 1996
Applicant:
Inventors:

Jeffrey Thomas Gotro, Endwell, NY (US);

Jeffrey Curtis Hedrick, Peekskill, NY (US);

Konstantinos Papathomas, Endicott, NY (US);

Niranjan Mohanlal Patel, Wappingers Falls, NY (US);

Alfred Viehbeck, Fishkill, NY (US);

William Joseph, Minneapolis, MN (US);

Assignee:

IBM Corporation, Armonk, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
523440 ; 523442 ; 523444 ; 525390 ; 525396 ; 525471 ; 525521 ; 525523 ; 525533 ; 525535 ; 525905 ; 525906 ;
Abstract

The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.


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