The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 1998

Filed:

May. 30, 1997
Applicant:
Inventors:

Daisuke Matsunaga, Kawasaki, JP;

Kazuo Hashimi, Kawasaki, JP;

Genichi Komuro, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; B44C / ; C23F / ; C23F / ;
U.S. Cl.
CPC ...
438714 ; 438710 ; 438713 ; 438719 ; 438723 ; 216 68 ; 216 70 ; 216 79 ;
Abstract

A laminated structure formed by alternately laminating a silicon film and a silicon oxide film is successively etched in the same chamber. Two groups are selected from groups A, B, and C, the group A including NF.sub.3, CF.sub.4, and SF.sub.6, the group B including CO, CHF.sub.3, CH.sub.2 F.sub.2, C.sub.2 F.sub.6, C.sub.3 F.sub.8, and C.sub.4 F.sub.8, and the group C including Cl.sub.2, HBr, HCl and Br.sub.2. The laminated structure is etched by successively etching one of the silicon film and the silicon oxide film by a combination of gases having a first mixture ratio and the other by the combination of gases having a second mixture ratio different from the first mixture ratio, the combination of gases including at least one kind of gas selected from one group of the selected two groups and at least one kind of gas selected from the other group. A technology of manufacturing a semiconductor device is provided which can etch an alternate laminate efficiently with a simple system.


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