The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 1998
Filed:
May. 28, 1996
Applicant:
Inventor:
Lai-Juh Chen, Hsin-Chu, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ; B24B / ;
U.S. Cl.
CPC ...
451-9 ; 451-9 ; 451 41 ; 451285 ;
Abstract
An improved and new apparatus and process for conditioning a chemical-mechanical polishing (CMP) pad has been developed, wherein sufficient conditioning is assured in order to restore the 'fresh pad' polish removal rate performance of the polishing pad, while at the same time prolong the life of the CMP polishing pad. The result is a lower cost process and improved product throughput for the CMP apparatus.
Chen, Lai-Juh. (1998). Chemical-mechanical polish (cmp) pad conditioner (U.S. Patent No. 5823854). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5823854
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile