The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 13, 1998

Filed:

Feb. 28, 1997
Applicant:
Inventors:

Kunio Kurihara, Tokyo, JP;

Masayuki Hashimoto, Chiba-ken, JP;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
118729 ; 118715 ; 118728 ; 156345 ;
Abstract

A wafer support device which supports a wafer horizontally from below in the process chamber of the semiconductor production device. A plate-shaped susceptor is placed below the wafer so that the plate surface is parallel to the wafer and has at least three through holes passing through it vertically. Lift pins which can each move axially pass through each of the through holes in the susceptor. Protrusions which support the wafer from its lower surface and which form a space between the wafer and the susceptor are installed on the upper ends of the lift pins. In this way reaction gas can flow between the wafer (2) and the susceptor (21) and form a thin film on the bottom surface of the wafer (2) as well as on the top surface.


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