The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 1998
Filed:
Jul. 17, 1997
Ron J Nagahara, San Jose, CA (US);
Dawn M Lee, San Jose, CA (US);
LSI Logic Corporation, , US;
Abstract
A polishing apparatus and method is disclosed, whereby fluid is delivered at dissimilar flow rates and pressures across a wafer. The fluid is delivered either directly to the wafer or through a polishing pad. Changing the fluid delivery allows the removal properties of the fluid to polish material from the wafer surface based on the location of that material relative to the center of the wafer. The fluid delivery system and the polishing pad oscillate relative to a rotating wafer. The radius of oscillation is relatively small compared to the size of the wafer to allow removal along one or more concentric rings and/or circles across the wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile